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Silicone Encapsulant for LED Chip (Self-Adhesive)


The self-adhesive silicone encapsulant for LED chip is an excellent viscoelastic material with high toughness, superior cold, heat and UV resistance and extraordinary adhesive performance to metal, PPA, ceramics and other substrates. The LED encapsulant is an ideal choice for encapsulation of LED chips.


Typical Properties
Before curing Physical properties SR2580A SR2580B
Appearance Colorless and transparent Colorless and transparent
Refractive index ( 25°C) 1.41 1.41
Density (g/ cm) 1.05 1.05
Viscosity ( 25°C) mPa·s 5500 4500
Mixing ratio 100 100
Viscosity after mixing ( 25°C ) mPa·s 5000
Operable time ( 25°C) > 8h
After curing SHORE hardness 70A
Refractive index ( 25°C) 1.41
Tensile strength (Mpa) 7
Elongation (%) 100%
Light transmittance (450 nm, 1 mm) 94%

1) Curing condition: first cure 100℃ x1 hours +post cure 150℃ x3hours
2) Store the silicone encapsulants at room temperature in an indoor dry and ventilated place without direct sunlight. Shelf life is 12 month.
3) Viscosity is measured by NDJ-79 rotary viscosimeter.
4) Parameters in above table are only for reference use. For detailed molding process, please contact us.

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